Assigning Thermal Material Properties

You specify values of thermal conductivities (KX) for the Aluminum substrate and the Silicon chip.

To input thermal conductivity for the Aluminum substrate:

  1. In the Simulation study tree, right-click aluminum_base-1 and select Apply/Edit Material .
  2. In the dialog box, right-click Custom Materials and select New Category.
  3. Right-click the New Category folder and select New Material. Then, select the newly defined material.
  4. In the Material properties box, do the following:
    1. Make sure that Linear Elastic Isotropic is selected as the Model Type.
    2. Set Units to SI - N/m^2 (Pa).
    3. Type Substrate Material for Name.
  5. In the material properties table:
    1. Type 2700 for Mass Density.
    2. Type 240 for Thermal Conductivity.
  6. Click Apply, then Close.
  7. Repeat the above procedure to specify a value of 2300 for the density and 1800 W/(m.K) (SI units) for the thermal conductivity of the Silicon_Chip-1 component.