In the electronic industry, chips are usually joined to substrates by a thin layer of epoxy. Similar situations are encountered in other industries. Modeling the epoxy layer as a separate component requires the use of a very small element size that can result in meshing failure or an unnecessarily large number of elements.
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To consider the thermal resistance caused by the epoxy layer, you do not need to model it. Thermal contact resistance is implemented as a surface-to-surface contact condition. You can either specify the total resistivity or the resistivity per unit area.
Modeling Thermal Contact Resistance