You enter the properties of the chip material manually.
The following is a list of the chip material properties:
| Property |
Value (SI units)
|
|---|
| Elastic modulus
|
4.1e11 N/m2
|
| Poisson's ratio
|
0.3
|
| Mass density
|
1250 kg/m3
|
| Thermal conductivity
|
Temperature-dependent (see next table)
|
| Thermal expansion coefficient
|
1e-6 K-1
|
| Specific heat (C)
|
670 J/(Kg.K)
|
The coefficient of thermal conductivity (KX) of the chips is temperature-dependent.
The temperature dependency of thermal conductivity of the chip material is given by the following data pairs:
| Temperature (K)
|
K (W/m.K)
|
|---|
| 100
|
390 |
| 150
|
260 |
| 200 |
195 |
| 250 |
156 |
| 300 |
130 |
| 350 |
110 |
| 400 |
98 |
| 450 |
87 |