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> Simulation Tutorials for SOLIDWORKS Connected Users > Thermal Tutorials (Simulation Professional and above) > Thermal Analysis > Description of the Model

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Thermal Analysis

Description of the Model

Creating a Steady State Thermal Study

Assigning Material to the Substrate

Assigning Material to the Chips: Process

Assigning Material to the Chips: Properties

Thermal Loads and Boundary Conditions

Applying Heat Power to the Chips

Applying Convection

Meshing the Model and Running the Study

Viewing Thermal Results

Using the Probe Tool

Generating an Iso Plot of Temperature

Checking Thermal Equilibrium

Creating a Transient Thermal Study

Using Drag and Drop to Assign Materials

Assigning Initial Temperature to Assembly Components

Drag and Drop Thermal Loads

Defining Time-Dependent Heat Power Condition

Editing the Heat Power Condition

Running the Transient Study

Viewing Temperatures at Different Solution Times

Viewing Temperatures at 900 Seconds

Viewing Temperature Change Versus Time

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Description of the Model

The assembly is made of a rectangular substrate (Ceramic Porcelain) of dimensions 40X40X1 mm, and 16 rectangular chips of dimensions 6X6X0.5 mm.

Each chip generates a maximum heat power of 0.2 Watts. The heat power increases from zero at time t = 0 and reaches its maximum value (0.2 W) after approximately 60 seconds. The coefficient of thermal conductivity of the chip varies with temperature.

The heat is dissipated by convection from the substrate. The convection heat transfer coefficient (Film coefficient) is 25 W/m² K and the bulk (ambient) temperature is 300 K.

Due to symmetry about two planes, we analyze one quarter of the model. The full model is shown below.

Search 'Description of the Model' in the SOLIDWORKS Knowledge Base.

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