Applying Heat Power Heat is generated in the Silicon chip at a rate of 25 Watts. In the Simulation study tree, right-click Thermal Loads and select Heat Power . Select silicon_chip<1> from the flyout FeatureManager design tree for Faces, Edges, Vertices, Components for Heat Power . In the PropertyManager, under Heat Power: Select SI in Unit . Type 25 for Heat Power . Click . Parent topicThermal Resistance of Thin Epoxy Layers Previous topic Applying Thermal Loads Next topic Applying Convection