Applying Convection Temperature of the cooling air is 25 °C and the overall heat convection coefficient is 250 W/m2K. In the Simulation study tree, right-click Thermal Loads and select Convection . In the graphics area, select the upper face of Silicon_Chip-1 and the bottom face of the Aluminum_Base-1 substrate for Faces for Convection . In the PropertyManager, select SI in Unit . Type 250 for Convection Coefficient . Type 298 for Bulk Ambient Temperature . Click . Parent topicThermal Resistance of Thin Epoxy Layers Previous topic Applying Heat Power Next topic Specifying Thermal Contact Condition