Specifying Thermal Contact Condition

To model the epoxy layer, you specify a distributed thermal resistance (thermal resistance per unit area of contacting faces) on the contacting faces of the chip and the substrate.

1. In the Simulation study tree, right-click Connections and select Local Interaction .
   The Local Interactions PropertyManager appears.
2. Set Type to Thermal Resistance.
3. Click inside the Faces, Edges, Vertices for Set 1 box , then click the lower face of the Silicon Chip.
4. Click inside the Faces for Set 2 box , then click the upper face of the Aluminum Base.
   
   If the exploded view is not active, activate it in the ConfigurationManager.
5. Select Thermal Resistance, then do the following:
   1. Set Units to SI.
   2. Select Distributed and type 1e-4 in the value box.
6. Click .